System-in-package and shrink

Reducing system size, weight, and power (SWaP) is critical to the development of new applications, especially for the defense industry. By achieving reductions in the form factor and power consumption of today's military and medical electronics, i3 is able to improve mobility and extend operational life, enhancing the overall viability of the product in the marketplace.

Our innovative System-in-Package technology is perfect for the following markets:

i3 has developed system-in-package technology to achieve SWaP goals, bring differentiated products to market quickly and efficiently, and to establish design and supply chain continuity.

Download our System-in-Package brochure