1st Level Assembly Is Our Specialty

At i3 Electronics we integrate advanced process and product development with manufacturing to provide flip chip and wire bond packaging assemblies ― from prototype to volume production.

We’ve earned global respect as assembly process experts, enabling customers to increase yields, continually improve processes, and optimize product reliability using our material science and engineering expertise.

Our solutions support the needs of the defense and aerospace, IT, server and super computing and medical markets where highly reliable products built in robust manufacturing operations are essential to success.

1st Level Assembly Capabilities:

Package Size

Assembly To Organic Substrates

Core Technology

Key Operations

Contact us today to fulfill your most challening 1st level assembly needs